Multi-nozzle placement head
Multiple nozzles pick up components and place them in sequence at the designed positions.
Technology
SMT lines that link processes
Line configuration linking printing, placement and inspection.
7SMT production lines
44Total placement machines
18Of these, DECAN S2 / F2 / S1
14Optical inspection positions
Hanwha
Hanwha placement technology from Korea, run on our shop floor
SMT placement machines for component feeding, vision recognition and precise placement.
DECAN series: 18 of 44 placement machines in total
Placement machines pick and place components at PCB design positions. Feeders, nozzles, programs and line setup are matched to each product.
SMT lines that link processes
Line configuration linking printing, placement and inspection.
- Printing · SPI
- Placing · Hanwha machines
- Optical inspection · reflow
Inline equipment configuration L1~L7
As of 2026-09-01| Line | S/P | SPI | Qty | S2 / F2 / S1 / SM | MAOI / AOI | RF | CPH nominal / planned |
|---|---|---|---|---|---|---|---|
| L1 | 2 | Sigma-X | 7 | S2·2 F2·1 S1·1 SM·3 | 3D + 3D | 1 | 115,600 · 92,480 |
| L2 | 2 | Sigma-X | 6 | F2·2 S1·1 SM·3 | 2D + 3D | 1 | 102,800 · 82,240 |
| L3 | 2 | Sigma-X | 7 | F2·2 S1·1 SM·4 | 2D + 3D | 1 | 105,000 · 84,000 |
| L4 | 2 | HS60 | 6 | F2·2 SM·4 | 2D + 3D | 1 | 102,550 · 82,040 |
| L5 | 2 | HS60 | 6 | F2·2 SM·4 | 2D + 3D | 2 | 102,550 · 82,040 |
| L6 | 2 | HS60 | 6 | F2·2 SM·4 | 2D + 3D | 2 | 102,550 · 82,040 |
| L7 | 2 | HS60 | 6 | F2·2 SM·4 | 2D + 3D | 2 | 102,550 · 82,040 |
| TOTAL | 14 | 7 | 44 | 2 · 13 · 3 · 26 | 8 + 6 | 10 | 733,600 · 586,880 |
- S/P = printers, Qty = placement machines, RF = reflow positions. Optical inspection: 8 × 3D + 6 × 2D.
- Inline quantities for L1~L7; machines held separately in stock are not included.
- CPH = placements per hour. Equipment-basis total: 733,600 × planning factor 80% = 586,880 placements/h.
- Not measured output, completed PCB quantities or spare capacity. L8 excluded. Process and available capacity are confirmed per product.
Precision printing and SPI — the start of placement quality
Print parameters and 3D measurement results are reviewed together.
01 Solder paste printing
Stencil alignment · paste deposition parameters checked
14 inline printers
02 3D SPI inspection
Height · area · volume and positional deviation
7 inline SPI positions
- Set print parameters
- Review SPI results
- Adjust · re-check
Product images from SJ and PARMI.
Component placement
We pick the part, read the position, and place it precisely
Hanwha placement equipment: 18 DECAN-series units · 26 SM-series units
Vision recognition · correction
The camera reads component position and angle and corrects the placement coordinates.
Examples of Hanwha placement-head and vision-recognition technology. Not photographs of an HIT installation.
Actual placement head and board transport on site, from different viewpoints
MAOI · AOI
MAOI · AOI inspection — screens and on-site judgement
We review anomalies in component placement and shape and refer them to the responsible process staff.
Example of a publicly released PARMI operating screen — a manufacturer example, not evidence of HIT records or installed options.
Board position · component zoom · 3D height · decision data
Operators, QC, repair technicians and equipment engineers review the results and confirm defects and adjust parameters within the scope agreed per product.
- Placement
- M-AOI
- TOP reflow
- BOT printing · BPR
- S-AOI
- BOT reflow
Optical inspection, 14 positions: 8 PARMI Xceed 3D + 6 MIRTEC 2D
Production process review matched to your board
We review the drawings, panel and component configuration to define which processes you can entrust to us.
PCB size
50 × 40 ~ 510 × 460 mm
Single-lane manufacturer specification. Compare against panel dimensions.
PCB thickness
0.38 ~ 4.2 mm
Board transport and support conditions are also checked.
Minimum chip code
03015 / 0402
L1~L3 include a 03015 platform / L4~L7 include a 0402 platform.
On-the-fly vision recognition
12 / 16 mm
Component in-plane size. Camera and nozzle conditions checked per model.
We also compare the permitted ranges for printing, placement, reflow and transport. We check board material, layer count, BGA, double-sided processing, production LOT and test requirements.
Equipment specifications are reviewed against each product's requirements. 0402 (metric) = 01005 (inch).
7 SMT lines / 44 placement machines
Production plan for 7 lines
Daily capacity and annual planned volume are stated separately.
Daily capacity · planning value
13,204,800
Component placements / day
586,880 placements/h × 22.5 h/day
Annual capacity · 240 days/year assumed
3,169,152,000
Component placements / year
13,204,800 placements/day × 240 days
733,600 placements/h × 80% planning factor = 586,880 placements/h. L8 excluded, 240 days/year assumed. Planning figures, not measured output, finished-board quantities or spare capacity.
From your first board, start with us
Development, pilot and series production enquiries. Contact us with your product and target schedule.